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Desktop semi-automatic wafer tape mounting equipment
Wafer tape mounting process equipment before wafer thinning and dicing process in semiconductor post-process.
• Corresponding processing of 4"~8"/8"~"12" wafer products
• Wafer Taper corresponding handling of tape thinning. After replacing the module, the platform can handle LC tape or PR tape
• Wafer Mounter corresponding handling of cut tape (Blue/UV/DAF tape)
Equipment model:
GTR306 series
GTR306 series
Product features:
• Advanced anti-static roller tape mounting technology is applied
• Automatic tape feeding & tape mounting
• Manual wafer/wafer ring loading and unloading
• Manual tape dicing
• Automatic waste tape collection
Technical specification and parameter:
Technical specification and parameter:
• Wafer type: silicon wafer/silicon carbide/gallium arsenide
• Wafer size: 4"~ 8"/ 8" ~12"
• Wafer thickness: 4"~ 8" ≥ 100um; 12" ≥ 200um;
• Tape type: Blue tape/UV tape
• Tape width: Max. 420mm
• Ring spec.: 6"/8"/12"Disco standard ring
• Carrier type: Vacuum airway, porous metal and microporous ceramics are optional
• Power consumption: AC220V 5A
• Control system: PLC & 7" touch screen
• Electrostatic elimination: Ion air pump
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