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Desktop semi-automatic wafer de-taping equipment
• GDR350 series is applicable to the tape peeling process after wafer thinning. Advanced tape peeling technology is applied, which can be compatible with adhesive tape and hot melt tape. 4 "-12" wafers can be processed.
• It is applicable to de-taping technology of wafers after thinning of 4-12 inches.
Equipment model:
GTR350 series
Technical specification and parameter:
GTR350 series
Product features:
• Advanced anti-static roller tape mounting technology is applied
• Automatic tape feeding & tape mounting
• Manual wafer/wafer ring loading and unloading
• Manual tape dicing
• Manual waste tape collection
Technical specification and parameter:
•Wafer type: silicon wafer/gallium carbide/gallium arsenide
• Wafer size: 4"~ 8"/ 8" ~12"
• Wafer thickness: less than 8" ≥ 100um; 12" ≥ 200um;
• Protective tape type: Blue tape/UV tape
• Type of tape peeled: Pyrolysis or UV BG tape
• Carrier type: Vacuum airway/porous metal/microporous ceramics are optional
• Carrier heating: Room temperature ~ 100℃
• Power consumption: AC220V 5A
• Control system: PLC & 7" touch screen
• Electrostatic elimination: Ion fan
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