Fully automatic Thinning wafer de-taping equipment

• ADW3300 series de-taping machine is applicable to the de-taping process after wafer thinning. Advanced de-taping technology isapplied, which can be compatible with adhesive tape and hot melt tape. 8/12-inch Taiko and non-Taiko wafers can be processed.

• It is applicable to tape peeling technology of wafers after thinning of 8"~12".

Description

Equipment model:
ADW3300 series

Product features:

•Advanced anti-static roller tape mounting technology is applied

• Automatic tape transfer and tape mounting (special mechanism can realize low tape tension)

• Automatic, safe and accurate transfer of wafers (Robot)

• Automatic intelligent detection of wafers in the cartridge to obtain wafer position information

• Auto-dicing of tape, auto-winding of waste tape

• Automatic non-contact wafer X-Y-θ position correction

• Vacuum or Bernoulli wafer handling technology

• SECS/GEM or simple networking capability

Technical specification and parameter:

• Wafer type: Taiko and non-Taiko wafers

• Wafer size: 4"~ 8"/ 8" ~12" compatible

• Wafer thickness: Taiko 8inch ≥ 100um, 12inch ≥ 150um; non-Taiko 8inch ≥ 80um, 12inch ≥ 100um; If the wafer is thinned twice, it can be customized to correspond to a slightly larger table or built-in pre-cut tape technology.

• Tape type: Various thinning process tapes

• Tape spec.: Pyrolysis or UV BG tape

• Carrier type: Vacuum airway/porous metal/microporous ceramics are optional

• Power consumption: AC220V, 12A

• Control system: PC+PLC Base

• Electrostatic elimination: Ion air pump

• UV function: Support

• Environmental cleaning: support

• Carrier cleaning: support

• Carrier heating: support

• SEC\GEM: support

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