With a steadfast commitment to excellence, our company specializes in the design, development, and manufacturing of semiconductor devices that are integral to a myriad of modern applications.
With a steadfast commitment to excellence, our company specializes in the design, development, and manufacturing of semiconductor devices that are integral to a myriad of modern applications.
With a steadfast commitment to excellence, our company specializes in the design, development, and manufacturing of semiconductor devices that are integral to a myriad of modern applications.
With a steadfast commitment to excellence, our company specializes in the design, development, and manufacturing of semiconductor devices that are integral to a myriad of modern applications.
• ASW6000 series wafer sorting equipment supports wafer mutual transfer between 2-6 PORTs, is compatible with SEMI standard Foup, Fosb and Open Cassette, and is equipped with microenvironment clean keeping system, which can meet the cleanliness requirements of Class1. Equipped with double-sided wafer barcode reading system and wafer inversion function, it can be applied to various application scenarios of wafer transmission. • Suitable for sorting and transmission of 8-12 inch wafers.
Semiconductor post-process, the wafer non-contact splitting process equipment after wafer laser stealth dicing process. • Corresponding processing of 4"~12" wafer product • Corresponding processing of blue tape, UV tape
• ADW3300 series de-taping machine is applicable to the de-taping process after wafer thinning. Advanced de-taping technology isapplied, which can be compatible with adhesive tape and hot melt tape. 8/12-inch Taiko and non-Taiko wafers can be processed. • It is applicable to tape peeling technology of wafers after thinning of 8"~12".
• GDR350 series is applicable to the tape peeling process after wafer thinning. Advanced tape peeling technology is applied, which can be compatible with adhesive tape and hot melt tape. 4 "-12" wafers can be processed. • It is applicable to de-taping technology of wafers after thinning of 4-12 inches.
ATW8000 series tape mounting machine is applicable to the tape mounting process before wafer dicing. Advanced vacuum tape mounting technology is applied to the equipment, which can complete the contact and non-contact high-quality tape mounting process of 8/12 inch Taiko and non-Taiko wafers.
At Ruihongyu Technology, we believe in a future where technology enriches lives, and we are dedicated to making that future a reality through our relentless pursuit of innovation and quality.
The semiconductor industry stands at the heart of modern technology, driving innovation and progress in various fields. Semiconductor devices, the key components of this industry, have revolutionized electronics, communication, computing, and numerous other areas. Let's delve into the world of semiconductors, under
The semiconductor industry stands at the heart of modern technology, driving innovation and progress in various fields. Semiconductor devices, the key components of this industry, have revolutionized electronics, communication, computing, and numerous other areas. Let's delve into the world of semiconductors, under
The semiconductor industry stands at the heart of modern technology, driving innovation and progress in various fields. Semiconductor devices, the key components of this industry, have revolutionized electronics, communication, computing, and numerous other areas. Let's delve into the world of semiconductors, under
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